Qualcomm Snapdragon processor 410 was developed in late 2013. Model name – MSM8916. The main application – mobile devices: smartphones and tablets.

Qualcomm Snapdragon 410 MSM8916

In chip integrated the following modules:

  • Module for the transmission of information in networks 4G LTE.
  • Module for processing information from the camera, the camera supports a resolution of up to 13.5 MP
  • Module for connecting the display, with supported screen resolution up to Full HD WUXGA (1920×1200), also have the option to transfer to an external display with a resolution picture HD (1280×720).
  • Processor based on Cortex-A53 cores with support for speeds up to 1.4 GHz with 32 or 64 bit system.
  • Adreno 306 graphics chip has 6 channels, clock frequency of 450MHz, supports DirectX 9.3.
  • GPS support
  • Support for sensor
  • Module DSP Digital signal processor DSP helps process information typically video streams and data.
  • The processor is manufactured on 28 nm technology.

Specs 410 MSM8916 Qualcomm Snapdragon

  • Quad-core ARM® Cortex™ A53 at up to 1.4 GHz per core
  • 32-bit and 64-bit capable
GPU graphicAdreno 306 GPU
DSPHexagon™ V50 DSP (up to 700MHz) Shared Modem & App DSP
  • Integrated 4G LTE World Mode, supporting LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO Rev. B, TD- SCDMA and GSM/EDGE
  • CAT4 speeds of up to 150 Mbps
  • 3rd Generation integrated LTE modem, with support for LTE-Broadcast and LTE multimode multi-SIM (TSTS, DSDA and DSDS)
RF3rd gen power efficient LTE multimode transceiver with Qualcomm RF360 Front End solution for world mode bands, lower power and PCB reduction
BluetoothBT4.0 † Integrated digital core
WiFi1-stream 802.11n † Integrated digital core
GPSQualcomm® IZat™ Gen8C
  • 1080p HD video playback and capture with H.264 (AVC)
  • 720p playback with H.265 (HEVC)
  • DASH is supported
CameraUp to 13.5MP
DisplayWUXGA (1920×1200) + 720p external display
Quick Charge
  • Quick Charge 1.0
  • 1.5A out
  • Integrated Fuel Gauge
  • Quick Charge 2.0
  • Up to 3A out
  • Current Path
Memory/ StorageLPDDR2/3 533MHz Single-channel 32-bit (4.2GBps) non-POP/ eMMC 4.51 SD 3.0 (UHS-I)
Process Technology28nm LP
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